MARC details
| 000 -LEADER |
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| fixed length control field |
03911nam a22004455i 4500 |
| 001 - CONTROL NUMBER |
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| control field |
978-0-387-79394-8 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20170628033358.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
110402s2009 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
9780387793948 |
| -- |
978-0-387-79394-8 |
| 024 7# - OTHER STANDARD IDENTIFIER |
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| Standard number or code |
10.1007/978-0-387-79394-8 |
| Source of number or code |
doi |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
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| Personal name |
Perkins, Andrew E. |
| Relator term |
author. |
| 245 10 - TITLE STATEMENT |
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| Title |
Solder Joint Reliability Prediction for Multiple Environments |
| Medium |
[electronic resource] / |
| Statement of responsibility, etc |
by Andrew E. Perkins, Suresh K. Sitaraman. |
| 264 #1 - |
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Boston, MA : |
| -- |
Springer US, |
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2009. |
| 300 ## - PHYSICAL DESCRIPTION |
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| Extent |
XVI, 192p. 70 illus. |
| Other physical details |
online resource. |
| 336 ## - |
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text |
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txt |
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rdacontent |
| 337 ## - |
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computer |
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c |
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rdamedia |
| 338 ## - |
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online resource |
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cr |
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rdacarrier |
| 347 ## - |
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text file |
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PDF |
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rda |
| 505 0# - FORMATTED CONTENTS NOTE |
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| Formatted contents note |
Background -- Literature Review -- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue -- Validation of Unified FEM for Thermal Cycling and Power -- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling -- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration -- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters -- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages -- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments -- Solder Joint Reliability Assessment for Desktop and Space Applications. |
| 520 ## - SUMMARY, ETC. |
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| Summary, etc |
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including: A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability, Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments, New insight into solder joint reliability testing under multiple environments, including vibration environments, A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type. Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
System safety. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Optical materials. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Materials. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Metallic Materials. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Optical and Electronic Materials. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Quality Control, Reliability, Safety and Risk. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Sitaraman, Suresh K. |
| Relator term |
author. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
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| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
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| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
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| Display text |
Printed edition: |
| International Standard Book Number |
9780387793931 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
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| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a> |
| 912 ## - |
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ZDB-2-ENG |
