MARC details
000 -LEADER |
fixed length control field |
03089nam a22005055i 4500 |
001 - CONTROL NUMBER |
control field |
978-1-4419-0076-0 |
003 - CONTROL NUMBER IDENTIFIER |
control field |
DE-He213 |
005 - DATE AND TIME OF LATEST TRANSACTION |
control field |
20170628033533.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
fixed length control field |
cr nn 008mamaa |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
fixed length control field |
130619s2009 xxu| s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9781441900760 |
-- |
978-1-4419-0076-0 |
024 7# - OTHER STANDARD IDENTIFIER |
Standard number or code |
10.1007/978-1-4419-0076-0 |
Source of number or code |
doi |
050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
Classification number |
TK7800-8360 |
050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
Classification number |
TK7874-7874.9 |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TJF |
Source |
bicssc |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TEC008000 |
Source |
bisacsh |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TEC008070 |
Source |
bisacsh |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
621.381 |
Edition number |
23 |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Gupta, Tapan. |
Relator term |
author. |
245 10 - TITLE STATEMENT |
Title |
Copper Interconnect Technology |
Medium |
[electronic resource] / |
Statement of responsibility, etc |
by Tapan Gupta. |
264 #1 - |
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New York, NY : |
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Springer New York : |
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Imprint: Springer, |
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2009. |
300 ## - PHYSICAL DESCRIPTION |
Extent |
XIX, 423 p. |
Other physical details |
online resource. |
336 ## - |
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text |
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txt |
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rdacontent |
337 ## - |
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computer |
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c |
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rdamedia |
338 ## - |
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online resource |
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cr |
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rdacarrier |
347 ## - |
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text file |
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PDF |
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rda |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Dielectric Materials -- Diffusion and Barrier Layers -- Pattern Generation -- Deposition Technologies of Materials for Cu-Interconnects -- The Copper Damascene Process and Chemical Mechanical Polishing -- Conduction and Electromigration -- Routing and Reliability. |
520 ## - SUMMARY, ETC. |
Summary, etc |
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials now prevails in the international microelectronics industry. However, as the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Engineering. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Electronics. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Systems engineering. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Optical materials. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Nanotechnology. |
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Engineering. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Optical and Electronic Materials. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Circuits and Systems. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Nanotechnology. |
710 2# - ADDED ENTRY--CORPORATE NAME |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Display text |
Printed edition: |
International Standard Book Number |
9781441900753 |
856 40 - ELECTRONIC LOCATION AND ACCESS |
Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-1-4419-0076-0">http://dx.doi.org/10.1007/978-1-4419-0076-0</a> |
912 ## - |
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ZDB-2-ENG |