MARC details
| 000 -LEADER |
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| fixed length control field |
03898nam a22004455i 4500 |
| 001 - CONTROL NUMBER |
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| control field |
978-1-4419-0962-6 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20170628033540.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
101207s2011 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
9781441909626 |
| -- |
978-1-4419-0962-6 |
| 024 7# - OTHER STANDARD IDENTIFIER |
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| Standard number or code |
10.1007/978-1-4419-0962-6 |
| Source of number or code |
doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
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| Classification number |
NA2543.B84 |
| 072 #7 - SUBJECT CATEGORY CODE |
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| Subject category code |
AMC |
| Source |
bicssc |
| 072 #7 - SUBJECT CATEGORY CODE |
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| Subject category code |
ARC009000 |
| Source |
bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
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| Classification number |
720 |
| Edition number |
23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
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| Personal name |
Papanikolaou, Antonis. |
| Relator term |
editor. |
| 245 10 - TITLE STATEMENT |
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| Title |
Three Dimensional System Integration |
| Medium |
[electronic resource] : |
| Remainder of title |
IC Stacking Process and Design / |
| Statement of responsibility, etc |
edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic. |
| 264 #1 - |
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| -- |
Boston, MA : |
| -- |
Springer US, |
| -- |
2011. |
| 300 ## - PHYSICAL DESCRIPTION |
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| Extent |
VIII, 246 p. |
| Other physical details |
online resource. |
| 336 ## - |
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| -- |
text |
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txt |
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rdacontent |
| 337 ## - |
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computer |
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c |
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rdamedia |
| 338 ## - |
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| -- |
online resource |
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cr |
| -- |
rdacarrier |
| 347 ## - |
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| -- |
text file |
| -- |
PDF |
| -- |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
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| Formatted contents note |
The next step in system integration: the benefits of going 3-D -- Process technology for manufacturing Through-Silicon Vias (TSVs) -- Alternative 3D integration schemes -- Manufacturing issues in 3D stacked ICs -- TSV characterization -- Physical design of 3D stacked ICs -- DRAM on logic stacking -- 3D general purpose micro-processors -- 3D system design: a holistic design approach. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc |
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Architecture. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Systems engineering. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Architecture. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name as entry element |
Basics of Construction. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Circuits and Systems. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Soudris, Dimitrios. |
| Relator term |
editor. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Radojcic, Riko. |
| Relator term |
editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
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| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Display text |
Printed edition: |
| International Standard Book Number |
9781441909619 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-1-4419-0962-6">http://dx.doi.org/10.1007/978-1-4419-0962-6</a> |
| 912 ## - |
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ZDB-2-ENG |
