Silicon Carbide Microsystems for Harsh Environments (Record no. 15829)

MARC details
000 -LEADER
fixed length control field 03620nam a22005055i 4500
001 - CONTROL NUMBER
control field 978-1-4419-7121-0
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20170628033557.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 110516s2011 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781441971210
-- 978-1-4419-7121-0
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-1-4419-7121-0
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7800-8360
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7874-7874.9
072 #7 - SUBJECT CATEGORY CODE
Subject category code TJF
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008000
Source bisacsh
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008070
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Wijesundara, Muthu B.J.
Relator term author.
245 10 - TITLE STATEMENT
Title Silicon Carbide Microsystems for Harsh Environments
Medium [electronic resource] /
Statement of responsibility, etc by Muthu B.J. Wijesundara, Robert Azevedo.
264 #1 -
-- New York, NY :
-- Springer New York,
-- 2011.
300 ## - PHYSICAL DESCRIPTION
Extent XVI, 232 p.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
490 1# - SERIES STATEMENT
Series statement MEMS Reference Shelf,
International Standard Serial Number 1936-4407 ;
Volume number/sequential designation 22
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Introduction to Harsh MEMs -- Silicon Carbide Processing -- Silicon Carbide Electronics -- Silicon Carbide MEMS Devices -- Silicon Carbide MEMs Device Packaging -- System Integration.
520 ## - SUMMARY, ETC.
Summary, etc <p><em>Silicon Carbide Microsystems for Harsh Environments</em> reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments. Technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation are discussed at length. The authors use the SiC technology platform suite as the model platform for developing harsh environment Microsystems, and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. This book also: </p> <ul>     <li>Addresses the SiC platform for complete microsystems and goes beyond the individual device level</li>     <li>Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems</li>     <li>Covers the challenges in combining SiC process and components to a microsystem</li>     <li>Discusses power source and signal transmission issues in the context of the harsh environment application space </li> </ul> <p><em>Silicon Carbide Microsystems for Harsh Environments</em> not only reviews the state-of-the-art MEMS devices, but also provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.</p>
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Systems engineering.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology and Microengineering.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Azevedo, Robert.
Relator term author.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9781441971203
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title MEMS Reference Shelf,
-- 1936-4407 ;
Volume number/sequential designation 22
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://dx.doi.org/10.1007/978-1-4419-7121-0">http://dx.doi.org/10.1007/978-1-4419-7121-0</a>
912 ## -
-- ZDB-2-ENG
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Home library Current library Date acquired Source of acquisition Total Checkouts Barcode Date last seen Price effective from Koha item type
    Dewey Decimal Classification     Central Library Central Library 28/06/2017 Springer EBook   E-39008 28/06/2017 28/06/2017 E-Book

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