TY  - BOOK
AU  - Bath,Jasbir
ED  - SpringerLink (Online service)
TI  - Lead-Free Soldering
SN  - 9780387684222
AV  - TK7800-8360 
U1  - 621.381 23
PY  - 2007///
CY  - Boston, MA
PB  - Springer US
KW  - Engineering
KW  - Electronics
KW  - Systems engineering
KW  - Environmental law
KW  - Optical materials
KW  - Materials
KW  - Electronics and Microelectronics, Instrumentation
KW  - Metallic Materials
KW  - Circuits and Systems
KW  - Optical and Electronic Materials
KW  - Environmental Law/Policy/Ecojustice
N1  - Lead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards
N2  - The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility
UR  - http://dx.doi.org/10.1007/978-0-387-68422-2
ER  -