TY  - BOOK
AU  - Liu,Johan
AU  - Salmela,Olli
AU  - Sarkka,Jussi
AU  - Morris,James E.
AU  - Tegehall,Per-Erik
AU  - Andersson,Cristina
ED  - SpringerLink (Online service)
TI  - Reliability of Microtechnology: Interconnects, Devices and Systems 
SN  - 9781441957603
AV  - TK7800-8360 
U1  - 621.381 23
PY  - 2011///
CY  - New York, NY
PB  - Springer New York
KW  - Engineering
KW  - System safety
KW  - Electronics
KW  - Optical materials
KW  - Electronics and Microelectronics, Instrumentation
KW  - Optical and Electronic Materials
KW  - Quality Control, Reliability, Safety and Risk
KW  - Nanotechnology and Microengineering
N1  - Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis
N2  - Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes�quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter
UR  - http://dx.doi.org/10.1007/978-1-4419-5760-3
ER  -