000 | 03192nam a22004815i 4500 | ||
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001 | 978-1-4419-7618-5 | ||
003 | DE-He213 | ||
005 | 20170628033600.0 | ||
007 | cr nn 008mamaa | ||
008 | 101109s2011 xxu| s |||| 0|eng d | ||
020 |
_a9781441976185 _9978-1-4419-7618-5 |
||
024 | 7 |
_a10.1007/978-1-4419-7618-5 _2doi |
|
050 | 4 | _aTK7888.4 | |
072 | 7 |
_aTJFC _2bicssc |
|
072 | 7 |
_aTEC008010 _2bisacsh |
|
082 | 0 | 4 |
_a621.3815 _223 |
100 | 1 |
_aSheibanyrad, Abbas. _eeditor. |
|
245 | 1 | 0 |
_a3D Integration for NoC-based SoC Architectures _h[electronic resource] / _cedited by Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch. |
264 | 1 |
_aNew York, NY : _bSpringer New York, _c2011. |
|
300 |
_aX, 278 p. _bonline resource. |
||
336 |
_atext _btxt _2rdacontent |
||
337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
||
347 |
_atext file _bPDF _2rda |
||
490 | 1 |
_aIntegrated Circuits and Systems, _x1558-9412 |
|
505 | 0 | _aThree-Dimensional Integration of Integrated Circuits - an Introduction -- The Promises and Limitation of 3-D Integration -- Testing 3D Stacked ICs Containing Through-Silicon Vias -- Design and Computer Aided Design of 3DIC -- Physical Analysis of NoC Topologies for 3-D Integrated Systems -- Three-Dimensional Networks-on-Chip: Performance Evaluation -- Asynchronous 3D-NoCs -- Design of Application-Specific 3D Networks-on-Chip Architectures -- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks -- 3-D NoC on Inductive Wireless Interconnect -- Influence of Stacked 3D Memory/Cache architectures on GPUs. | |
520 | _aBack Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures. | ||
650 | 0 | _aEngineering. | |
650 | 0 | _aSoftware engineering. | |
650 | 0 | _aSystems engineering. | |
650 | 1 | 4 | _aEngineering. |
650 | 2 | 4 | _aCircuits and Systems. |
650 | 2 | 4 | _aSoftware Engineering. |
700 | 1 |
_aPétrot, Frédéric. _eeditor. |
|
700 | 1 |
_aJantsch, Axel. _eeditor. |
|
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9781441976178 |
830 | 0 |
_aIntegrated Circuits and Systems, _x1558-9412 |
|
856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4419-7618-5 |
912 | _aZDB-2-ENG | ||
999 |
_c15869 _d15869 |